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VSP-88D PRO

VSP-88D PRO

Application

Adhesion strength improved in D/B, W/B and M/D processes
Solution for delamination in mold process
Customer-tailored design

Specification

Substrate Width /
Actual SPH
Max 74mm : 4Lanes/Chamber : 820 strips/Hr(adjustable 40~74mm)
Max 62mm : 5Lanes/Chamber : 1010 strips/Hr(adjustable 40~62mm)
Available 1~3 Lanes for wide PCB/substrate over 82mm width
Power Source RF Generator, 13.56MHz, 1000Watts
Vacuum Pump Dry pump 2 x 620L/min [Option : Oil pump]
Gas Flow Controller 1 mass flow controller for standard/Chamber
[Option : additional MFC (O2 or other gas)]
System Dimension W1800 x H1860 x D1270mm
External chamber dimension W304 x H115 x D455mm
Internal chamber dimension W284 x H35 x D430mm (Plasma area)
Utility 220VAC, 3Phase, Air 4~6kgf/㎠
PC Based Main Control Windows XP & C++ Language & TFT LCD Touch Screen

Features

-Excellent cleaning competence – water drop contact angle of 10 deg. or lower dependent upon materials
-High productivity with simultaneous working on four lanes and short cleaning time
-Design of simple utility connection, and vertical up down chamber
-Single inline system
-Vacuum plasma of small chamber
-PC-based operation and facilitated operation with touch screen
-LAN networking and CIM