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VSP-88D
Application
No delamination
Adhesion strength improved in W/B and D/B processes
Customer-tailored design
Specification
| Substrate Width / Actual SPH |
Max 82mm : 4 Rail 420Strip/Hr |
|---|---|
| Max 62mm : 5 Rail 540Strip/Hr | |
| Available 1~3 Lanes for Wide PCB/Substrate over 82mm Width | |
| Power Source | RF Generator, 13.56MHz, 1000W |
| Vacuum Pump | 617L/Min Dry Pump [Option : Oil Rotary Pump] |
| Gas Flow Controller | 1 Mass Flow Controller for Standard [Option : Additional MFC (O2 or Other Gas)] |
| System Dimension | W1700mm * H1480mm * D1050mm (Except Tower Lamp)[Pump Built-in Type] |
| Internal Chamber Size | W290mm * H27.4mm * D442 (Plasma Area) |
| Weight | 800Kg |
| Utility | 220VAC, 3Phase, 25A, Air : 5kgf/㎠, Ar : 3kgf/㎠, N2 : 4kgf/㎠ |
| PC Based Main Control | Windows XP ＆ C++ Language ＆ TFT LCD Touch Screen |
Features
-Excellent cleaning competence – water drop contact angle of 10 deg. or lower dependent upon materials
-High productivity with simultaneous working on four lanes and short cleaning time
-Design of simple utility connection, and vertical up down chamber
-Single inline system
-Vacuum plasma of small chamber
-PC-based operation and facilitated operation with touch screen
-System of affordable prices and capable of saving labor costs
-LAN networking and CIM