我们将竭尽全力做出更好的产品。
VSP-888 SH2
Application
为了在晶圆级封装中形成凸块而加以改善的系统
选择性清除Scum以及稳定的电镀水平
Specification
| PlasmaSource | ICP& RF bais |
|---|---|
| WaferSize | 200mm/ 300mm |
| WaferTransfer | ATMTransfer |
| SystemDimension | 2970(W)x 2210(D) x 1800(H)mm |
| ProcessChamber | Max4 |
| Application | Descum(PR, PI, PBO, BCB) |
| SurfaceModification | |
| Etch(SiO2,Si3N4) | |
| Operating Software | Windows7 |
| FIDES– cluster control software |
Features
- High throughput : ~ < 170 WPH
- Good Etching Uniformity : < 3%
- ATM dual hands platform
- Low CoC By optimized simple chamber design