No delamination
Adhesion strength improved in W/B and D/B processes
Customer-tailored design
Substrate Width / Actual SPH |
Max 74mm : 4Lanes/Chamber : 400 strips/Hr(adjustable 40~74mm) |
---|---|
Max 62mm : 5Lanes/Chamber : 460 strips/Hr(adjustable 40~62mm) | |
Available 1~3 Lanes for wide PCB/substrate over 82mm width | |
Power Source | RF Generator, 13.56MHz, 1000Watts |
Vacuum Pump | Dry pump 620L/min [Option : Oil pump] |
Gas Flow Controller | 1 mass flow controller for standard/Chamber |
[Option : additional MFC (O2 or other gas)] | |
System Dimension | W1800 x H1530 x D1270mm |
External chamber dimension | W304 x H115 x D455mm |
Internal chamber dimension | W284 x H35 x D430mm (Plasma area) |
Utility | 220VAC, 3Phase, Air 4~6kgf/㎠ |
PC Based Main Control | Windows XP & C++ Language & TFT LCD Touch Screen |
-Consistent cleaning competence – water drop contact angle of 10 deg. or lower dependent upon materials
-High productivity with simultaneous working on four lanes and short cleaning time
-Design of simple utility connection, and vertical up down chamber
-Single inline system
-Vacuum plasma of small chamber
-PC-based operation and facilitated operation with touch screen
-System of affordable prices and capable of saving labor costs
-LAN networking and CIM